A total of 22 billion yuan ($3.3 billion) was agreed to be invested in the integrated circuit industry in Haicang district, Xiamen, Fujian province on Dec 18.
Haicang district government signed a strategic cooperation agreement with Hangzhou Silan Microelectronics Co to establish three production lines in Haicang.
The agreement states that Silan Microelectronics Co along with Xiamen Semiconductor Investment Group is expected to invest 22 billion yuan for the production lines of wafer and semiconductor devices.
Two wafer production lines are projected to garner an investment of 17 billion yuan, while the products are micro-electromechanical systems, power semiconductor devices and other related devices.
The rest of the capital plans to be spent in setting up a production line of semiconductor devices, including optical communication module chips, radio frequency related modules and high-end light emitting diode chips.
Chen Xiangdong, president of Hangzhou Silan Microelectronics Co, said that both Xiamen and Haicang district have issued related policies to create an integrated circuit industry hub. This makes it suitable for enterprises like us to invest in Xiamen.
Wang Huilian, general manager of Xiamen Semiconductor Investment Group, commented that Haicang district has worked out a special development path for integrated circuit industry by taking into consideration of the industry's development trend at home and abroad and introducing professional teams and industrial resources.
This cooperation is important towards improving China's core competitiveness in special technology of integrated circuit industry, exploring the development model of China's integrated circuit industry and helping Xiamen's such industry occupy a significant position in China's national strategic layout.
Founded in 1997, the Hangzhou Silan Microelectronics Co has developed into a leading enterprise in designing and manufacturing integrated circuit chips, semiconductors and microelectronics in China.