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Zhuhai-developed face ID chip popular at London expo
Updated: Jun 20, 2017
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FaceOS, a face identification hardware module developed by Zhuhai Openface Technology, received positive attention at London Tech Week 2017 which took place from June 12 to 16.
FaceOS, first domestically produced face recognition intelligent chip
The face recognition system is the size of a business card and has already been applied in several domestic security domains. Given its globally advanced algorithms and high-resolution capabilities in comparison and identification, the company hopes to broaden its application further.
The developer, an industry-leading biological recognition core equipment supplier, is one of the startups being incubated at the scientific innovation incubator of the Guangdong Zhuhai Public Entrepreneurship Incubation (Training) Base.
Relying on long-term R&D experience in deep-learning algorithms, artificial intelligence chips, and big data cloud platforms, the company provides governments, public security departments, operators and other professional users with typical products and solutions. These include the high-resolution face recognition system FaceOS, biological recognition module, and a human face big data platform.
Visitor to London Tech Week shows interest in FaceOS [Photos courtesy South Plus]
Company founder Wang Haizeng who graduated from Tsinghua University with an MBA in 2014 said that participating in the exhibition served to popularize the company's products and technologies in the overseas market. He also expected to open markets in the UK and offer solutions for global security issues by providing cutting-edge intelligent hardware technology.
London Tech Week is the largest tech event in Europe and gathers together the most advanced science and technology projects to showcase the latest developments and trends. As the largest innovation city in Europe, London has incubated 43 percent of European technological unicorn enterprises. This year's China-UK Hi! Technology Festival saw a focus on artificial intelligence, Internet of Things, front-end intelligence, and intelligent modules.
